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dc.contributor.authorGuckel, Henryen_US
dc.contributor.authorLarsen, S.en_US
dc.contributor.authorLagally, Max G.en_US
dc.contributor.authorMoore, Georgeen_US
dc.contributor.authorMiller, Jeffrey B.en_US
dc.contributor.authorWiley, John D.en_US
dc.date.accessioned2007-07-13T19:18:25Z
dc.date.available2007-07-13T19:18:25Z
dc.date.issued1977en_US
dc.identifier.citationThe following article appeared in Guckel, H., Larsen, S., Lagally, M.G., Moore, G., Miller, J.B., & Wiley, J.D. (1977). Electromechanical Devices Utilising Thin Si Diaphragms. Applied Physics Letters, 31(9), 618-19. and may be found at http://link.aip.org/link/?apl/31/618en_US
dc.identifier.urihttp://digital.library.wisc.edu/1793/9136
dc.descriptionThis material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.en_US
dc.format.extent165580 bytes
dc.format.mimetypeapplication/pdfen_US
dc.format.mimetypeapplication/pdf
dc.relation.ispartofhttp://www.aip.orgen_US
dc.relation.ispartofhttp://apl.aip.org/en_US
dc.rightsCopyright 1977 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics.en_US
dc.titleElectromechanical devices utilising thin Si diaphragmsen_US
dc.identifier.doihttp://dx.doi.org/10.1063/1.89802en_US


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