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dc.contributor.authorSolak, Harun H.en_US
dc.contributor.authorLorusso, GianFrancoen_US
dc.contributor.authorSingh-Gasson, Sangeeten_US
dc.contributor.authorCerrina, Francescoen_US
dc.date.accessioned2007-07-13T19:18:05Z
dc.date.available2007-07-13T19:18:05Z
dc.date.issued1999en_US
dc.identifier.citationThe following article appeared in Solak, H.H., Lorusso, G.F.S.G.S., & Cerrina, F. (1999). An X Ray Spectromicroscopic Study Of Electromigration In Patterned Al(Cu) Lines. Applied Physics Letters, 74(1), 22-4. and may be found at http://link.aip.org/link/?apl/74/22en_US
dc.identifier.urihttp://digital.library.wisc.edu/1793/9092
dc.descriptionThis material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.en_US
dc.format.extent146473 bytes
dc.format.mimetypeapplication/pdfen_US
dc.format.mimetypeapplication/pdf
dc.publisherAmerican Institute of Physicsen_US
dc.relation.ispartofhttp://www.aip.orgen_US
dc.relation.ispartofhttp://apl.aip.org/en_US
dc.rightsCopyright 1999 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics.en_US
dc.titleAn X-ray spectromicroscopic study of electromigration in patterned Al(Cu) linesen_US
dc.identifier.doihttp://dx.doi.org/10.1063/1.123120en_US


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