Measurement of strain in Al-Cu interconnect lines with x-ray microdiffraction
Solak, Harun H.
Legnini, Daniel G.
American Institute of Physics Inc
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The following article appeared in Solak, H.H., Vladimirsky, Y., Cerrina, F., Lai, B., Yun, W., Cai, Z., et al. (1999). Measurement Of Strain In Al Cu Interconnect Lines With X Ray Microdiffraction. Journal Of Applied Physics, 86(2), 884-890. and may be found at http://link.aip.org/link/?jap/86/884