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X-ray microdiffraction study of Cu interconnects

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dc.contributor.author Zhang, Xueyuan en_US
dc.contributor.author Solak, Harun H. en_US
dc.contributor.author Cerrina, Francesco en_US
dc.contributor.author Lai, Barry en_US
dc.contributor.author Cai, Zhonghou en_US
dc.contributor.author Ilinski, Peter en_US
dc.contributor.author Legnini, Daniel G. en_US
dc.contributor.author Rodrigues, William en_US
dc.date.accessioned 2007-07-13T19:18:01Z
dc.date.available 2007-07-13T19:18:01Z
dc.date.issued 2000 en_US
dc.identifier.citation The following article appeared in Zhang, X., Solak, H., Cerrina, F., Lai, B., Cai, Z., Ilinski, P., et al. (2000). X Ray Microdiffraction Study Of Cu Interconnects. Applied Physics Letters, 76(3), 315-317. and may be found at http://link.aip.org/link/?apl/76/315 en_US
dc.identifier.uri http://digital.library.wisc.edu/1793/9082
dc.description This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. en_US
dc.description.provenance Made available in DSpace on 2007-07-13T19:18:01Z (GMT). No. of bitstreams: 1 file_1.pdf: 229283 bytes, checksum: 2b81575dc144a223e7248dcf61d316ca (MD5) Previous issue date: 2000 en
dc.format.extent 229283 bytes
dc.format.mimetype application/pdf en_US
dc.format.mimetype application/pdf
dc.publisher American Institute of Physics Inc en_US
dc.relation.ispartof http://www.aip.org en_US
dc.relation.ispartof http://apl.aip.org/ en_US
dc.rights Copyright 2000 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics. en_US
dc.title X-ray microdiffraction study of Cu interconnects en_US
dc.identifier.doi http://dx.doi.org/10.1063/1.125731 en_US

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