X-ray microdiffraction study of Cu interconnects

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Author(s): Zhang, Xueyuan; Solak, Harun H.; Cerrina, Francesco; Lai, Barry; Cai, Zhonghou; Ilinski, Peter; Legnini, Daniel G.; Rodrigues, William
Publisher: American Institute of Physics Inc
Citation: The following article appeared in Zhang, X., Solak, H., Cerrina, F., Lai, B., Cai, Z., Ilinski, P., et al. (2000). X Ray Microdiffraction Study Of Cu Interconnects. Applied Physics Letters, 76(3), 315-317. and may be found at http://link.aip.org/link/?apl/76/315
Date: 2000
Part of: http://www.aip.org; http://apl.aip.org/
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Permanent link: http://digital.library.wisc.edu/1793/9082
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