X-ray microdiffraction study of Cu interconnects
Solak, Harun H.
Legnini, Daniel G.
American Institute of Physics Inc
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The following article appeared in Zhang, X., Solak, H., Cerrina, F., Lai, B., Cai, Z., Ilinski, P., et al. (2000). X Ray Microdiffraction Study Of Cu Interconnects. Applied Physics Letters, 76(3), 315-317. and may be found at http://link.aip.org/link/?apl/76/315