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    A shell model for the filament structure of Bi-2223 conductors

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    file_1.pdf (2.146Mb)
    Date
    2005
    Author
    Holesinger, Terry G.
    Kennison, Jack A.
    Liao, Shaolin
    Yuan, Yongwen
    Jiang, Jianyi
    Cai, Xueyu
    Hellstrom, Eric E.
    Larbalestier, David C.
    Baurceanu, Ruxandra M.
    Maroni, Victor A.
    Huang, Yibing
    Publisher
    IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
    Metadata
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    Permanent Link
    http://digital.library.wisc.edu/1793/8996
    Part of
    • College of Engineering Publications

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