A shell model for the filament structure of Bi-2223 conductors

File(s)
Date
2005Author
Holesinger, Terry G.
Kennison, Jack A.
Liao, Shaolin
Yuan, Yongwen
Jiang, Jianyi
Cai, Xueyu
Hellstrom, Eric E.
Larbalestier, David C.
Baurceanu, Ruxandra M.
Maroni, Victor A.
Huang, Yibing
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC