A shell model for the filament structure of Bi-2223 conductors

File(s)

file_1.pdf (2.146Mb)

Date

2005

Author

Holesinger, Terry G.

Kennison, Jack A.

Liao, Shaolin

Yuan, Yongwen

Jiang, Jianyi

Cai, Xueyu

Hellstrom, Eric E.

Larbalestier, David C.

Baurceanu, Ruxandra M.

Maroni, Victor A.

Huang, Yibing

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

Metadata

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Permanent Link

http://digital.library.wisc.edu/1793/8996

Part of

College of Engineering Publications