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dc.contributor.authorLee, Seong-Minen_US
dc.contributor.authorStone, Donald S.en_US
dc.date.accessioned2007-07-13T19:16:50Z
dc.date.available2007-07-13T19:16:50Z
dc.date.issued1990en_US
dc.identifier.citationLee, S.M., & Stone, D. S. (1990). Grain boundary sliding in surface mount solders during thermal cycling. In 1990 Proceedings of the 40th Electronic Components and Technology Conference, May 20-23 1990, 1, 491-495.en_US
dc.identifier.urihttp://digital.library.wisc.edu/1793/8928
dc.descriptionThis material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.en_US
dc.format.extent947819 bytes
dc.format.mimetypeapplication/pdfen_US
dc.format.mimetypeapplication/pdf
dc.publisherPubl by IEEE, Piscataway, NJ, USAen_US
dc.relation.ispartofhttp://www.ieee.org/en_US
dc.relation.ispartofhttp://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000248en_US
dc.rightsCopyright 1990 Institute of Electrical and Electronics Engineersen_US
dc.rights©20xx IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.en_US
dc.titleGrain boundary sliding in surface mount solders during thermal cyclingen_US


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