Grain boundary sliding in surface mount solders during thermal cycling
File(s)
Date
1990Author
Lee, Seong-Min
Stone, Donald S.
Publisher
Publ by IEEE, Piscataway, NJ, USA
Metadata
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http://digital.library.wisc.edu/1793/8928Related Material/Data
http://www.ieee.org/http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000248
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Citation
Lee, S.M., & Stone, D. S. (1990). Grain boundary sliding in surface mount solders during thermal cycling. In 1990 Proceedings of the 40th Electronic Components and Technology Conference, May 20-23 1990, 1, 491-495.