Bonding silicon-on-insulator to glass wafers for integrated bio-electronic circuits
Kim, Hyun S.
Blick, Robert H.
Kim, Dong Min
American Institute of Physics Inc., Melville, NY 11747-4502, United States
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The following article appeared in Kim, H. S., Blick, R. H., Kim, D.M., & Eom, C.B. (2004). Bonding Silicon On Insulator To Glass Wafers For Integrated Bio Electronic Circuits. Applied Physics Letters, 85(12), 2370-2372. and may be found at http://link.aip.org/link/?apl/85/2370