Show simple item record

dc.contributor.authorRasheed, Aous Naji
dc.contributor.authorMuthalif, Asan G. A.
dc.contributor.authorSaleh, Tanveer
dc.date.accessioned2014-05-19T19:38:49Z
dc.date.available2014-05-19T19:38:49Z
dc.date.issued2014-03-25
dc.identifier.citationICOMM 2014 No. 72en
dc.identifier.urihttp://digital.library.wisc.edu/1793/68989
dc.description.abstractMicro-Wire Electro-discharge machining (micro-WEDM) is a nonconventional machining technology which is extensively used for metal based micro fabrication process. This is a non-contact machining process where material removal is taken place by electro-thermal action. micro-WEDM process is difficult to be applied for semiconductor material like Silicon (Si). In this paper a new approach is proposed for machining polished Si (p-type, resistivity 1-50 micro-cm) wafer. In this method, initially Si workpiece is coated with a conductive material (gold for this study) and then micro-WEDM operation is carried out. Finally, after WEDM operation, the conductive layer is removed from the polished Si substrate without damaging the substrate. WEDM process stability was found to be improved (up to 60 times for certain machining condition) if coated Si wafer is used as compared to uncoated Si workpiece. Material removal rate was also found to be increased by a good margin (~ 100% maximum) for coated Si wafer. Overall this new method of micro-WEDM operation of polished Si wafer has been found to be more efficient and useful.en
dc.publisher9th International Conference on MicroManufacturing (ICOMM 2014)
dc.subjectmicro-WEDMen
dc.subjectpolished Si waferen
dc.subjectconductive coatingen
dc.titleImproving micro-wire electro-discharge machining operation of polished silicon wafer by conductive coatingen
dc.typeConference paperen


Files in this item

Thumbnail
Thumbnail
Thumbnail
Thumbnail

This item appears in the following Collection(s)

Show simple item record