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Stress and Deformation Analysis at the Micro-Scale

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Author(s)
Korsunsky, Alexander M.
Publisher
9th International Conference on MicroManufacturing (ICOMM 2014)
Citation
ICOMM 2014 No. 88
Date
Mar 25, 2014
Subject(s)
digital image correlation; residual stress; diffraction; x-ray; focused ion beam; electron microscopy
Abstract
Improving the structural integrity of microstructured materials relies on the combination of advancements in modeling capability and spatially resolved experimental characterization of deformation and damage. We report the recent advancements in the use of synchrotron X-ray diffraction techniques, as well as in the methods utilizing micro-scale material removal in combination with scanning electron microscopy and digital image correlation for relief strain measurement and stress evaluation.
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http://digital.library.wisc.edu/1793/68780 
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