Show simple item record

dc.contributor.authorJasperson, Benjamin A.
dc.contributor.authorPfefferkorn, Frank E.
dc.contributor.authorQu, Weilin
dc.contributor.authorTurner, Kevin T.
dc.date.accessioned2013-05-10T16:36:51Z
dc.date.available2013-05-10T16:36:51Z
dc.date.issued2010-05-05
dc.identifier.citationICOMM 2010 No. 73en
dc.identifier.urihttp://digital.library.wisc.edu/1793/65527
dc.description.abstractA combination of lithography-based microfabrication and micro end milling is used to manufacture thin-film resistance temperature detector (RTD) heat flux sensors on bulk copper substrates. The fabrication process uses photoresist patterning, metal deposition, and lift-off to build the sensor and micro-end milling to segment the sensors. Micro end milling tests were performed to establish determine the optimum conditions for sensor removal which minimized delamination and burr formation. It was determined that starting on the backside (opposite the sensor) of the copper wafer and machining through to the thin film layers resulted in the least amount of burr formation.en
dc.publisher5th International Conference on MicroManufacturing (ICOMM 2010)
dc.subjectcopper substrateen
dc.subjectheat fluxen
dc.subjectthin film sensoren
dc.titleA Thin-Film Heat Flux Sensor Fabricated on Copper for Heat Transfer Measurements in Parallel Channel Heat Sinksen
dc.typeOtheren


Files in this item

Thumbnail
Thumbnail
Thumbnail
Thumbnail

This item appears in the following Collection(s)

Show simple item record