A comparison of wet manual cleaning processes to carbon dioxide cleaning processes in the semiconductor industry

Abstract

The purpose of the study was to analyze the risk exposures and costs involved in cleaning parts, equipment, and tooling in the semiconductor industry using wet manual processes and compare carbon dioxide as an alternative cleaning process. The research focuses on wet manual processes currently used by semiconductor manufacturers to clean parts, tools, and equipment and carbon dioxide cleaning processes as an alternative to these processes. A current analysis of the chemicals used in the wet manual processes and the risks they pose to an organization compared to the risks associated with carbon dioxide processes. The research concludes that carbon dioxide blast cleaning processes reduce or eliminate employee health exposures, wastewater discharge, hazardous waste treatment costs, reduced environmental reporting requirements and liability issues, and clean at or better than current wet manual processes