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dc.contributor.authorWang, Weitungen_US
dc.contributor.authorFoster, Johnen_US
dc.contributor.authorSnodgrass, Thomas G.en_US
dc.contributor.authorWendt, Amy E.en_US
dc.contributor.authorBooske, John H.en_US
dc.date.accessioned2007-07-13T19:31:59Z
dc.date.available2007-07-13T19:31:59Z
dc.date.issued1999en_US
dc.identifier.citationThe following article appeared in Wang, W., Foster, J., Snodgrass, T., Wendt, A.E., & Booske, J.H. (1999). An Rf Sustained Argon And Copper Plasma For Ionized Physical Vapor Deposition Of Copper. Journal Of Applied Physics, 85(11), 7556-7561. and may be found at http://link.aip.org/link/?jap/85/7556en_US
dc.identifier.urihttp://digital.library.wisc.edu/1793/10930
dc.descriptionThis material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.en_US
dc.format.extent123193 bytes
dc.format.mimetypeapplication/pdfen_US
dc.format.mimetypeapplication/pdf
dc.publisherAmerican Institute of Physics Incen_US
dc.relation.ispartofhttp://www.aip.orgen_US
dc.relation.ispartofhttp://jap.aip.orgen_US
dc.rightsCopyright 1999 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics.en_US
dc.titleAn rf sustained argon and copper plasma for ionized physical vapor deposition of copperen_US
dc.identifier.doihttp://dx.doi.org/10.1063/1.370554en_US


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