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    An rf sustained argon and copper plasma for ionized physical vapor deposition of copper

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    file_1.pdf (120.3Kb)
    Date
    1999
    Author
    Wang, Weitung
    Foster, John
    Snodgrass, Thomas G.
    Wendt, Amy E.
    Booske, John H.
    Publisher
    American Institute of Physics Inc
    Metadata
    Show full item record
    Permanent Link
    http://digital.library.wisc.edu/1793/10930
    Part of
    • College of Engineering Publications

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