An rf sustained argon and copper plasma for ionized physical vapor deposition of copper

File(s)

file_1.pdf (120.3Kb)

Date

1999

Author

Wang, Weitung

Foster, John

Snodgrass, Thomas G.

Wendt, Amy E.

Booske, John H.

Publisher

American Institute of Physics Inc

Metadata

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Permanent Link

http://digital.library.wisc.edu/1793/10930

Part of

College of Engineering Publications