An rf sustained argon and copper plasma for ionized physical vapor deposition of copper

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Author(s): Wang, Weitung; Foster, John; Snodgrass, Thomas G.; Wendt, Amy E.; Booske, John H.
Publisher: American Institute of Physics Inc
Citation: The following article appeared in Wang, W., Foster, J., Snodgrass, T., Wendt, A.E., & Booske, J.H. (1999). An Rf Sustained Argon And Copper Plasma For Ionized Physical Vapor Deposition Of Copper. Journal Of Applied Physics, 85(11), 7556-7561. and may be found at http://link.aip.org/link/?jap/85/7556
Date: 1999
Part of: http://www.aip.org; http://jap.aip.org
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Permanent link: http://digital.library.wisc.edu/1793/10930
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