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    • College of Engineering, University of Wisconsin--Madison
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    A statistical analysis of copper bottom coverage of high-aspect-ratio features using ionized physical vapor deposition

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    file_1.pdf (230.8Kb)
    Date
    2002
    Author
    Snodgrass, Thomas G.
    Shohet, J. Leon
    Publisher
    Institute of Electrical and Electronics Engineers Inc
    Metadata
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    Permanent Link
    http://digital.library.wisc.edu/1793/10368
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    • College of Engineering Publications

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