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dc.contributor.authorSolak, Harun H.en_US
dc.contributor.authorVladimirsky, Yulien_US
dc.contributor.authorCerrina, Francescoen_US
dc.contributor.authorLai, Barryen_US
dc.contributor.authorYun, Wenbingen_US
dc.contributor.authorCai, Zhonghouen_US
dc.contributor.authorIlinski, Peteren_US
dc.contributor.authorLegnini, Daniel G.en_US
dc.contributor.authorRodrigues, Williamen_US
dc.date.accessioned2007-07-13T19:18:04Z
dc.date.available2007-07-13T19:18:04Z
dc.date.issued1999en_US
dc.identifier.citationThe following article appeared in Solak, H.H., Vladimirsky, Y., Cerrina, F., Lai, B., Yun, W., Cai, Z., et al. (1999). Measurement Of Strain In Al Cu Interconnect Lines With X Ray Microdiffraction. Journal Of Applied Physics, 86(2), 884-890. and may be found at http://link.aip.org/link/?jap/86/884en_US
dc.identifier.urihttp://digital.library.wisc.edu/1793/9090
dc.descriptionThis material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.en_US
dc.format.extent217501 bytes
dc.format.mimetypeapplication/pdfen_US
dc.format.mimetypeapplication/pdf
dc.publisherAmerican Institute of Physics Incen_US
dc.relation.ispartofhttp://www.aip.orgen_US
dc.relation.ispartofhttp://jap.aip.orgen_US
dc.rightsCopyright 1999 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics.en_US
dc.titleMeasurement of strain in Al-Cu interconnect lines with x-ray microdiffractionen_US
dc.identifier.doihttp://dx.doi.org/10.1063/1.370819en_US


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