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Bonding silicon-on-insulator to glass wafers for integrated bio-electronic circuits

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Author(s)
Kim, Hyun S.; Blick, Robert H.; Kim, Dong Min; Eom, Chang-Beom
Publisher
American Institute of Physics Inc., Melville, NY 11747-4502, United States
Citation
The following article appeared in Kim, H. S., Blick, R. H., Kim, D.M., & Eom, C.B. (2004). Bonding Silicon On Insulator To Glass Wafers For Integrated Bio Electronic Circuits. Applied Physics Letters, 85(12), 2370-2372. and may be found at http://link.aip.org/link/?apl/85/2370
Date
2004
Part of
http://www.aip.org; http://apl.aip.org/
Description
This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.
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http://digital.library.wisc.edu/1793/8560 
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