MINDS @ UW About MINDS @ UW
 

MINDS @ UW >
MINDS@UW Madison >
College of Engineering, University of Wisconsin--Madison >
Department of Civil and Environmental Engineering >
Master's Theses--Civil Engineering >

Please use this identifier to cite or link to this item: http://digital.library.wisc.edu/1793/7963

Title: Estimating The Relationship Between Cost And Condition For Routine Highway Operations And Maintenance
Authors: Sokolowski, David
Advisors: Adams, Teresa M.
Keywords: Dissertations, Academic Civil and Environmental Engineering.
University of Wisconsin--Madison. College of Engineering.
Thesis (M.S.)--University of Wisconsin--Madison, 2007.
Issue Date: 17-May-2007
Abstract: When transportation agencies prepare design for new highway construction or major improvements to existing highways, the agency and user lifecycle costs are considered in project design decisions. Yet when highway projects are completed, maintenance budgets are rarely adjusted to accommodate the routine maintenance of new lane miles. This problem is worsened by the fact that each year the number of vehicle miles traveled per highway mile increases. Maintenance budgets do not keep pace or remain constant. The growing disparity between maintenance budgets and maintenance requirements causes agencies to make tough choices about maintenance priorities. Aside from concerns about preserving capital investment; highway operations and maintenance bureaus have concerns about safety and loss of operational efficiency due to deteriorating condition of roadways.
Description: Under the supervision of Professor Teresa Adams; Pages: 126.
URI: http://digital.library.wisc.edu/1793/7963
Appears in Collections:Master's Theses--Civil Engineering

Files in This Item:

File Description SizeFormatHandle
Sokolowski2007.pdf1752KbAdobe PDFhttp://digital.library.wisc.edu/1793/7964View/Open

Refworks Export

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

 

Valid XHTML 1.0! DSpace Software Copyright © 2002-2006 MIT and Hewlett-Packard - Feedback