Fluid Property Effects on Spray Cooling: An Experimental and Numerical Study
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- Author(s)
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Ashwood, Andrea C.
- Publisher
- University of Wisconsin-Madison
- Citation
- Ashwood, A.C. (2006). Fluid Property Effects on Spray Cooling: An Experimental and Numerical Study. Master's Thesis, University of Wisconsin-Madison.
- Date
- 2006
- Subject(s)
-
Thesis (M.S.)--University of Wisconsin--Madison, 2006.; Dissertations Academic Mechanical Engineering.; University of Wisconsin--Madison. College of Engineering.
- Abstract
- Spray cooling is a process where liquid is atomized into droplets and sprayed onto a
surface that is hotter than the saturation temperature of the fluid. The droplets impact the
surface and spread, causing a thin liquid film to form. This liquid film is capable of removing
large heat loads from the surface. The purpose of this study is to investigate the behavior of
the spray film on the chip surface. Both pure fluids and mixtures were analyzed in an effort
to ascertain the effects of fluid properties and to increase the performance of traditional spray
systems. Measurements of the applied heat flux and temperatures at 8 locations per chip
were taken. Measurements were also recorded for the conditions of the fluid being delivered
to the die. From these, heat transfer coefficients and surface temperature distributions were
obtained.
Separately, the first step toward a general model of spray cooling was developed. The
velocity distribution was characterized by two layers: the viscous sublayer, characterized
by a linear profile, and the fully turbulent region, characterized by a power law profile. A
numerical model and correlation for the thin film were both derived based on the two layer
theory using a velocity profile predicted by a computational fluid dynamics (CFD) model
in an effort to ascertain the fundamental behaviors behind the spray cooling phenomena.
The model included mass flow and momentum equations integrated through the thickness
of the thin liquid film and was implemented in an iterative software program (EES) with
good agreement to previous empirical data. The correlation was also in good agreement to
the data obtained in this work.
- Description
- Under the supervision of Professor Timothy A. Shedd; 129pp.
- Sponsor(s)
- Sponsored by Cray, Inc. and the Center for Power Electronic Systems.
- Permanent link
-
http://digital.library.wisc.edu/1793/7632
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