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Magnetic-field-enhanced rf argon plasma for ionized sputtering of copper

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dc.contributor.author Wang, Weitung en_US
dc.contributor.author Foster, John en_US
dc.contributor.author Wendt, Amy E. en_US
dc.contributor.author Booske, John H. en_US
dc.contributor.author Onuoha, Tina en_US
dc.contributor.author Sandstrom, Perry W. en_US
dc.contributor.author Liu, Henley L. en_US
dc.contributor.author Gearhart, Steven S. en_US
dc.contributor.author Hershkowitz, Noah en_US
dc.date.accessioned 2007-07-13T19:32:05Z
dc.date.available 2007-07-13T19:32:05Z
dc.date.issued 1997 en_US
dc.identifier.citation The following article appeared in Wang, W., Foster, J., Wendt, A.E., Booske, J.H., Onuoha, T., Sandstrom, P.W., et al. (1997). Magnetic Field Enhanced Rf Argon Plasma For Ionized Sputtering Of Copper. Applied Physics Letters, 71(12), 1622-1624. and may be found at http://link.aip.org/link/?apl/71/1622 en_US
dc.identifier.uri http://digital.library.wisc.edu/1793/10944
dc.description This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. en_US
dc.description.provenance Made available in DSpace on 2007-07-13T19:32:05Z (GMT). No. of bitstreams: 1 file_1.pdf: 57337 bytes, checksum: 9b7707d2fa9ae3edb0ce463d03e14a87 (MD5) Previous issue date: 1997 en
dc.format.extent 57337 bytes
dc.format.mimetype application/pdf en_US
dc.format.mimetype application/pdf
dc.publisher American Institute of Physics en_US
dc.relation.ispartof http://www.aip.org en_US
dc.relation.ispartof http://apl.aip.org/ en_US
dc.rights Copyright 1997 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics. en_US
dc.title Magnetic-field-enhanced rf argon plasma for ionized sputtering of copper en_US

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