An rf sustained argon and copper plasma for ionized physical vapor deposition of copper
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Date
1999Author
Wang, Weitung
Foster, John
Snodgrass, Thomas G.
Wendt, Amy E.
Booske, John H.
Publisher
American Institute of Physics Inc
Metadata
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http://digital.library.wisc.edu/1793/10930Description
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Citation
The following article appeared in Wang, W., Foster, J., Snodgrass, T., Wendt, A.E., & Booske, J.H. (1999). An Rf Sustained Argon And Copper Plasma For Ionized Physical Vapor Deposition Of Copper. Journal Of Applied Physics, 85(11), 7556-7561. and may be found at http://link.aip.org/link/?jap/85/7556