| dc.contributor.author |
Brown, April S. |
en_US |
| dc.contributor.author |
Jokerst, Nan Marie |
en_US |
| dc.contributor.author |
Doolittle, Alan |
en_US |
| dc.contributor.author |
Brooke, Martin |
en_US |
| dc.contributor.author |
Kuech, Thomas F. |
en_US |
| dc.contributor.author |
Seo, Sang-Woo |
en_US |
| dc.contributor.author |
Kang, Sangbeom |
en_US |
| dc.contributor.author |
Huang, Sa |
en_US |
| dc.contributor.author |
Shen, Jeng-Jung |
en_US |
| dc.date.accessioned |
2007-07-13T19:29:39Z |
|
| dc.date.available |
2007-07-13T19:29:39Z |
|
| dc.date.issued |
2001 |
en_US |
| dc.identifier.citation |
Brown, A. S., Nan, J. Marie, D., Alan, B., Martin, K., Thomas F., Seo, S.W., et al. (2001). Heterogeneous integration: From substrate technology to active packaging. In IEEE International Electron Devices Meeting IEDM 2001, Dec 2-5 2001, , 197-200. |
en_US |
| dc.identifier.uri |
http://digital.library.wisc.edu/1793/10620 |
|
| dc.description |
This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. |
en_US |
| dc.description.provenance |
Made available in DSpace on 2007-07-13T19:29:39Z (GMT). No. of bitstreams: 1
file_1.pdf: 313393 bytes, checksum: 090c7e75952143922be4af18e1f1fa63 (MD5)
Previous issue date: 2001 |
en |
| dc.format.extent |
313393 bytes |
|
| dc.format.mimetype |
application/pdf |
en_US |
| dc.format.mimetype |
application/pdf |
|
| dc.publisher |
Institute of Electrical and Electronics Engineers Inc |
en_US |
| dc.relation.ispartof |
http://www.ieee.org/ |
en_US |
| dc.relation.ispartof |
http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000245 |
en_US |
| dc.rights |
Copyright 2001 Institute of Electrical and Electronics Engineers |
en_US |
| dc.rights |
©20xx IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. |
en_US |
| dc.title |
Heterogeneous integration: From substrate technology to active packaging |
en_US |
| dc.identifier.doi |
http://dx.doi.org/10.1109/IEDM.2001.979465 |
en_US |
