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Please use this identifier to cite or link to this item:
http://digital.library.wisc.edu/1793/10620
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| Title: | Heterogeneous integration: From substrate technology to active packaging |
| Authors: | Brown, April S.
Jokerst, Nan Marie
Doolittle, Alan
Brooke, Martin
Kuech, Thomas F.
Seo, Sang-Woo
Kang, Sangbeom
Huang, Sa
Shen, Jeng-Jung |
| Issue Date: | 2001 |
| Publisher: | Institute of Electrical and Electronics Engineers Inc |
| Citation: | Brown, A. S., Nan, J. Marie, D., Alan, B., Martin, K., Thomas F., Seo, S.W., et al. (2001). Heterogeneous integration: From substrate technology to active packaging. In IEEE International Electron Devices Meeting IEDM 2001, Dec 2-5 2001, , 197-200. |
| Description: | This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. |
| URI: | http://digital.library.wisc.edu/1793/10620 |
| Appears in Collections: | College of Engineering Publications
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| file_1.pdf | | 306Kb | Adobe PDF | http://digital.library.wisc.edu/1793/10621 | View/Open |
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