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Evolution of core density of Ag-clad Bi-2223 tapes during process

Jiang, Jianyi; Cai, Xueyu; Chandler, Jermal G.; Rikel, Mark O.; Hellstrom, Eric E.; Parrella, Ronald D.; Yu, Dingan; Li, Qi; Rupich, Martin W.; Riley, Gilbert N., Jr.; Larbalestier, David C. (Institute of Electrical and Electronics Engineers Inc; 2001)
Improving the critical current density in Bi-2223 wires via a reduction of the secondary phase content

Huang, Yibing; Cai, Xueyu; Holesinger, Terry G.; Maroni, Victor A.; Yu, Dingan; Parrella, Ronald D.; Rupich, Martin W.; Hellstrom, Eric E.; Teplitsky, Mark; Venkataraman, Kartik; Otto, Alexander; Larbalestier, David C. (IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC; 2003)
Progress in superconducting performance of rolled multifilamentary Bi-2223 HTS composite conductors

Li, Qi; Riley, Gilbert N., Jr.; Parrella, Ronald D.; Fleshler, Steven; Rupich, Martin W.; Carter, William L.; Willis, Jeffrey O.; Coulter, J. Yates; Bingert, John F.; Sikka, Vinod K.; Parrell, Jeffrey A.; Larbalestier, David C. (IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC; 1997)

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